The IUP Journal of Mechanical Engineering
Evaluating the Performance of Electroplated Composite Fins in Plate Heat Exchangers
Article Details
| Pub. Date | : May, 2022 |
|---|---|
| Product Name | : The IUP Journal of Marketing Management |
| Product Type | : Article |
| Product Code | : IJMM030522 |
| Author Name | : A Kalyan Charan, Syed Wajihullah Ishaq, Mohammad Khaja Rafay and M Vinay Bhargav |
| Availability | : YES |
| Subject/Domain | : Marketing |
| Download Format | : PDF Format |
| No. of Pages | : 12 |
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Abstract
The paper analyzes heat transfer in a longitudinal rectangular composite fin. Temperature-dependent thermal conductivity is carried out for forced convections with the aid of pin-fin apparatus. The fins used are electroplated and the base material is covered with a coating of another metal (say, copper coating on aluminum by hydrolysis) which has higher thermal conductivity than the base metal. The rate of electroplating by which the metal deposition takes place is 0.25 micrometers/min (approx.). The sulphates and nitrates of corresponding metals to be deposited are used in performing electroplating. Then the composite rectangular fin is analyzed on different parameters. The results are further validated using ANSYS.
Introduction
A fin is an extended surface from an object to increase the heat transfer rate to environment by increasing convection. Adding a fin increases the surface area so that it becomes an economical solution to some of the heat transfer problems. When the surface area is increased, more fluid contact to increase the rate of heat transfers from the base surface is available in comparison to a fin without the extension provided. The concept of heat transfer through perforated fin array is also one of the methods to improve the heat transfer character.
Keywords
Steady state thermal loads, Heat transfer, Heat exchanger, Plate heat exchanger, Electroplating, Electroplated composite materials, Aluminum fins, Copper fins, Pinfin apparatus, ANSYS Workbench, Convective heat transfer coefficient, Conductive heat flux, Heat distribution, Heat dissipation
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