The IUP Journal of Mechanical Engineering
Novel Arrangement for Pin-Fin Heat Sinks to Improve Efficiency of Thermal Dissipation
Article Details
| Pub. Date | : Aug, 2023 |
|---|---|
| Product Name | : The IUP Journal of Marketing Management |
| Product Type | : Article |
| Product Code | : IJMM020823 |
| Author Name | : Juan Ramirez-Vazquez and Martin Nieto-Perez |
| Availability | : YES |
| Subject/Domain | : Marketing |
| Download Format | : PDF Format |
| No. of Pages | : 29 |
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Abstract
The paper presents a 3D design and model of thermo-hydrodynamic behavior, applying Computational Fluid Dynamics (CFD) for pin-fin heat sink with square shape (rectangular fin profile) design through a novel pin arrangement that improves heat removal in the system. The novelty consists in the insertion of a deflector row that will help to direct the flow, such that the air flow directly hits the rectangular cross-sectional fins present in the system. The heat sink model is placed in the channel designed, in which air flows as a suitable medium, and its overall performance is investigated. In addition, a constant heat flux is applied to the bottom wall of the heat sink model that corresponds to the heat flux generated by current electronic equipment and devices. The numerical results of global thermal resistance, pressure drop and Nusselt number are reported. The results allow determining the best arrangement of geometry/configuration, location and functionality of the fin-deflectors, collocated for evaluating the thermal-hydraulic efficiency of the system.
Introduction
Power devices have gained significance over the years as they provide numerous
environmental, economic and national interest benefits over the conventional internal
combustion engine-based vehicles (Jiaqiang et al., 2017; Shi et al., 2018 and Wu
et al., 2019). Electronic equipment operating in thermal hostile environment demands
special care in thermal sizing at the design stage, fixing attention on power losses
minimization and cooling system optimization (CERN LHC IT-3330/PH/EXP
Technical Specification, 2004).
Ramirez et al. (2012) carried out a numerical study to understand the thermal
and hydrodynamic behavior of a pin-fin heat sink and reported the dimensions of
Keywords
Heat sink, Global thermal resistance, Pressure drop, Nusselt number, Fin-deflectors, Computational Fluid Dynamics (CFD)
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